New insights into board level drop impact

E. H. Wong, Y. W. Mai

Research output: Journal article publicationJournal articleAcademic researchpeer-review

38 Citations (Scopus)

Abstract

This paper presents new insights into board level drop impact using analytical relations that have been developed. The dominance of bending moment as a failure driver leads naturally to the dynamic-static analysis technique, which together with the dominance of fundamental flexing mode led to a simple relation for interconnection stress. Using this relation, it has been found that miniaturisation of interconnection with accompanying reduction in load bearing area is the most significant source of drop impact vulnerability. Finally, a low cost PCB has been proposed with equivalent dynamic characteristic and near equivalent interconnection stress as the eight-layer microvia board specified in JEDEC Std JESD22-B111.

Original languageEnglish
Pages (from-to)930-938
Number of pages9
JournalMicroelectronics Reliability
Volume46
Issue number5-6
DOIs
Publication statusPublished - May 2006
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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