New analysis on the fiber push-out problem with interface roughness and thermal residual stresses

Young S. Chai, Yiu Wing Mai

Research output: Journal article publicationJournal articleAcademic researchpeer-review

31 Citations (Scopus)

Abstract

An improved analysis considering the effects of interface roughness and thermal residual stresses in both radial and axial directions is developed for the single fiber push-out test. The roughness of the interface, which has a significant effect on the fiber sliding behavior, is expressed by a Fourier series expansion that has good convergence and can handle general shapes of roughness. The interfacial shear stress that plays an important role in interfacial debonding is very much affected by the axial thermal residual stress in the bonded region, which can induce a two-way debonding mechanism. It has been found that both residual stress and interface roughness have pronounced effects on the stress transfer across the interface and interfacial debonding behaviour.

Original languageEnglish
Pages (from-to)2095-2104
Number of pages10
JournalJournal of Materials Science
Volume36
Issue number8
DOIs
Publication statusPublished - 15 Apr 2001
Externally publishedYes

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Science (miscellaneous)
  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering
  • Polymers and Plastics

Fingerprint

Dive into the research topics of 'New analysis on the fiber push-out problem with interface roughness and thermal residual stresses'. Together they form a unique fingerprint.

Cite this