Abstract
Aluminum nitride (AlN) films were prepared by using reactive magnetron sputtering. Substrate temperature Ts, radio frequency power Pw, and substrate materials (including silicon, platinum coated silicon and sapphire) were varied as deposition parameters. Ts-Pwdiagrams were worked out to illustrate how the film structure can be controlled to vary over a broad range covering nearly amorphous, polycrystalline, texture and epitaxial structures. Increases in Tsand Pwhave the effects of increasing the thermal energy of the species on the substrate surface, and enhancing the crystallization of the deposits and preferential orientation of grains. Sapphire substrate has better lattice matching with the AlN structure, which further facilitates the epitaxial growth of the AlN structure.
Original language | English |
---|---|
Pages (from-to) | 1603-1608 |
Number of pages | 6 |
Journal | Diamond and Related Materials |
Volume | 13 |
Issue number | 9 |
DOIs | |
Publication status | Published - 1 Sept 2004 |
Keywords
- Aluminum nitride films
- Epitaxial growth
- Reactive magnetron sputtering
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- General Chemistry
- Mechanical Engineering
- General Physics and Astronomy
- Materials Chemistry
- Electrical and Electronic Engineering