Nanostructured copper interfaces for enhanced boiling

The effect of copper (Cu) nanorod deposition on Cu substrate on the boiling performance for nanostructured Cu surfaces has been evaluated. Cu nanorods were deposited on a polished CU substrate by oblique-angle deposition, in which a flux of Cu atoms is incident on the substrate at a large incidence angle. The test facility used to evaluate the effect of nanorod deposition on the boiling performance consisted of a Cu block, liquid chamber, liquid supply system, and heating system. During the boiling tests, the power to the heater was increased and the process repeated until the critical heat flux (CHF) was achieved. Significant differences in the dynamics of bubble nucleation and release from the Cu nanorods, including higher bubble release frequencies and a considerable increase in the density of active bubble nucleation sites. Nanostructured Cu interfaces exhibited enhanced boiling performance at low superheated temperatures compared to untreated Cu, caused by such large increase in the density of active bubble nucleation sites.