Nanosolder for low temperature lead-free electronic interconnect applications

Research output: Authored / edited book › Research book or monograph (as author) › Academic research

Original language	English
Publisher	PCB Technology Centre, Dept. of Industrial and Systems Engineering, The Hong Kong Polytechnic University
ISBN (Print)	9789881895912, 988189591X
Publication status	Published - 2011

Keywords

@book{3d7b5d87576f47d987b1d6cd75024e04,

title = "Nanosolder for low temperature lead-free electronic interconnect applications",

keywords = "Lead-free electronics manufacturing processes, Solder and soldering",

author = "Yung, \{Kam Chuen\} and C.P. Lee and S.K. Pang",

year = "2011",

language = "English",

isbn = "9789881895912",

publisher = "PCB Technology Centre, Dept. of Industrial and Systems Engineering, The Hong Kong Polytechnic University",

}

TY - BOOK

T1 - Nanosolder for low temperature lead-free electronic interconnect applications

AU - Yung, Kam Chuen

AU - Lee, C.P.

AU - Pang, S.K.

PY - 2011

Y1 - 2011

KW - Lead-free electronics manufacturing processes

KW - Solder and soldering

M3 - Research book or monograph (as author)

SN - 9789881895912

SN - 988189591X

BT - Nanosolder for low temperature lead-free electronic interconnect applications

PB - PCB Technology Centre, Dept. of Industrial and Systems Engineering, The Hong Kong Polytechnic University

ER -