Nanosolder for low temperature lead-free electronic interconnect applications

Kam Chuen Yung, C.P. Lee, S.K. Pang

Research output: Authored / edited bookResearch book or monograph (as author)Academic research

Original languageEnglish
PublisherPCB Technology Centre, Dept. of Industrial and Systems Engineering, The Hong Kong Polytechnic University
ISBN (Print)9789881895912, 988189591X
Publication statusPublished - 2011


  • Lead-free electronics manufacturing processes
  • Solder and soldering

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