Multiresponse optimization of surface plasma treatment using Taguchi method

Kam Chuen Yung, H. Liem, H. S. Choy, H. F. Zheng, Tai Man Yue

Research output: Journal article publicationJournal articleAcademic researchpeer-review

11 Citations (Scopus)


Emerging plasma treatment on printed circuit boards has many applications from desmearing to micro/nanomanipulating of surface chemistry. However, the methodology to predict their mechanism behaviors and quantify their process performance is hampered by the fact that each plasma treatment response is very sensitive to a small change in a technologic parameter, undesirably causing detrimental effect on the overall response. This study thus uses Taguchi's parameter design to identify the essential technologic parameters affecting the plasma treatment performance. The factor combinations for process performance optimization are observed to be intrinsically distinct for different polymer substrates. The optimal level correlation between responses and control factors is established by means of signal-to-noise (S/N) ratio. The analysis of variance is employed to identify the priority of factor influence. Finally, both predicted and experimental results are compared to determine the efficacy of using the proposed methodology to optimize the surface plasma treatment process.
Original languageEnglish
Pages (from-to)1001-1011
Number of pages11
JournalMaterials and Manufacturing Processes
Issue number9
Publication statusPublished - 1 Sept 2010


  • Optimization
  • Plasma surface treatment
  • Printed circuit board
  • Taguchi method

ASJC Scopus subject areas

  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering


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