Molecular dynamics simulation of polishing process based on coupling vibrations of liquid

Zhigang Huang, Zhongning Guo, Xing Cheng, Daming Yu, Xue Du, Rongbing Li

Research output: Journal article publicationJournal articleAcademic researchpeer-review

2 Citations (Scopus)

Abstract

Molecular dynamics method is applied to study the machining mechanisms of polishing based on coupling vibrations of liquid. The physical phenomena of abrasive particles bombarding on silicon monocrystal surface are simulated using Tersoff potentials. The effects of vibration parameters, particle size, incident angle and particle material are analyzed and discussed. Material removal mechanisms are studied. Deformation and embedment phenomena are found in the simulations. Bombardment will destroy the crystal structures near the impact point, and adhesion effect is responsible for final removal of material.
Original languageEnglish
Pages (from-to)19-24
Number of pages6
JournalChinese Journal of Mechanical Engineering (English Edition)
Volume19
Issue number1
Publication statusPublished - 1 Mar 2006

Keywords

  • Molecular dynamics simulation
  • Ultra-smooth polishing
  • Ultrasonic vibration

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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