Abstract
This article surveys the advances of molecular dynamics (MD) simulation in the research of ultrafine machining and related technologies. Modeling methods, including interatomic potentials and boundary conditions, are addressed. Algorithm strategies for MD simulations are discussed. By applying simulations with Tersoff potential, a case study of the material removal mechanism of the polishing based on coupling vibrations of liquid (PCVL) is presented.
Original language | English |
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Pages (from-to) | 393-397 |
Number of pages | 5 |
Journal | Materials and Manufacturing Processes |
Volume | 21 |
Issue number | 4 |
DOIs | |
Publication status | Published - 1 Jul 2006 |
Keywords
- Molecular dynamics
- Polishing
- Simulation
- Ultrafine machining
- Ultrasonic vibration
ASJC Scopus subject areas
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering
- Industrial and Manufacturing Engineering