Moisture sensor using reactive sputtered TiO₂thin film with negative substrate bias

Keyphrases

• Process Control 100%
• Moisture 100%
• Electronic Packaging 100%
• Negative Substrate Bias 100%
• TiO2 Thin Film 100%
• Sensing chip 100%
• Reactive Sputter Process 100%
• Moisture Sensor 100%
• Moisture Sensing 100%
• Low Temperature 50%
• High Temperature 50%
• Monitoring System 50%
• Sol-gel Method 50%
• High Performance 50%
• In Situ 50%
• Order of Magnitude 50%
• Fabrication Methods 50%
• Annealing Time 50%
• Adsorption 50%
• Over 40 50%
• Batch Production 50%
• Humidity 50%
• Time Monitoring 50%
• Sensing Film 50%
• Process Window 50%
• Device Failure 50%
• Reliability Test 50%
• Atomic Force Microscope 50%
• Porous Silicon 50%
• Microscope Image 50%
• Electronic Devices 50%
• Process Uniformity 50%
• Controlled Environmental Conditions 50%
• Current Change 50%
• Hysteresis Response 50%
• Electronics Reliability 50%
• Thin Film Technology 50%
• Powder Sintering Method 50%
• Package Reliability 50%
• Tellers 50%

Engineering

• Process Control 100%
• Substrate Bias 100%
• Using Sensor 100%
• Reactive Sputtering 100%
• Low-Temperature 50%
• Fabrication Technique 50%
• Monitoring Device 50%
• Reliability Analysis 50%
• Major Factor 50%
• Sensing Film 50%
• Process Window 50%
• Batch Manufacturing 50%
• Sol-Gel Process 50%
• Atomic Force Microscope 50%
• Annealing Time 50%
• Moisture Performance 50%
• Illustrates 50%
• Film Technology 50%
• Powder Sintering Method 50%
• Thin Films 50%
• Relative Humidity 50%
• Porous Silicon 50%

Material Science

• Film 100%
• Process Control 100%
• Sol-Gel 50%
• Annealing 50%
• Thin Films 50%
• Porous Silicon 50%
• Sintering 50%