Moisture sensor using reactive sputtered TiO2thin film with negative substrate bias

L. L.W. Chow, M. M.F. Yuen, Philip Ching Ho Chan, A. Teng

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

2 Citations (Scopus)


Moisture has been known as a major factor in degrading the reliability of electronic packages. It is estimated that over 40 % of failures in electronic devices are induced by moisture. The use of micro-moisture-sensing-chips in electronic package reliability tests can provide in-situ and real-time monitoring device failures under controlled environmental conditions. Some previously published fabrication techniques of high performance moisture sensors include very high temperature powder sintering method [1-3], sol-gel method [4] and etching porous silicon [5] under complex and sophisticated process control. All these methods are not compatible to the conventional IC processing. In this paper, simple and low temperature fabricated moisture sensing chips using reactive sputtering process in thin film technology are characterized. Reactive sputtering process has been widely employed in IC batch production for its high process control and uniformity. The adsorption response being well fitted into Brunauer, Emmett and Teller (BET) Type III model and Atomic Force Microscope (AFM) images illustrate that the sensing films are pore-free. A process window for improving hysteresis performance is obtained by applying a negative substrate bias during sputtering and increasing the annealing time. The sensitivity of four orders of magnitude in d. c. current change over 11 %-97 % relative humidity (RH) is achieved.
Original languageEnglish
Title of host publicationInternational Symposium on Electronic Materials and Packaging, EMAP 2000
Number of pages8
ISBN (Electronic)0780366549, 9780780366541
Publication statusPublished - 1 Jan 2000
Externally publishedYes
EventInternational Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, Hong Kong
Duration: 30 Nov 20002 Dec 2000


ConferenceInternational Symposium on Electronic Materials and Packaging, EMAP 2000
Country/TerritoryHong Kong
CityHong Kong

ASJC Scopus subject areas

  • Engineering(all)

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