Modeling of electrocrystallization for pulse current electroforming of nickel

K. P. Wong, Kang Cheung Chan, Tai Man Yue

Research output: Journal article publicationJournal articleAcademic researchpeer-review

19 Citations (Scopus)

Abstract

A mathematical model has been established for formulating the effect of different types of waveform on the three-dimensional electrocrystallization of nickel electroforms. The model describes how the different types of waveform influence the rate of three-dimensional nucleation, J, the rate of three-dimensional step growth via surface diffusion path, JSD, and the rate of three-dimensional step growth via direct transfer path, JDT, at the cathodic surface. Moreover, the dynamic electrocrystallization process including J, JSDand JDTwas simulated. The highest maximum nucleation rate was obtained when a ramp-down waveform was employed. The highest step growth rate either via surface diffusion path or direct transfer path was obtained when conventional rectangular waveform was used. The best quality of electroforms, in terms of fine-grained structure, was found when a ramp-down waveform was employed. These results are in agreement with the findings of our previous studies.
Original languageEnglish
Pages (from-to)178-189
Number of pages12
JournalApplied Surface Science
Volume178
Issue number1-4
DOIs
Publication statusPublished - 2 Jul 2001

Keywords

  • Deposit quality
  • Electrocrystallization
  • Pulse current electroforming
  • Shaped waveform
  • Simulation

ASJC Scopus subject areas

  • Physical and Theoretical Chemistry
  • Surfaces, Coatings and Films
  • Condensed Matter Physics

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