Mission Profile-Based System-Level Reliability Prediction Method for Modular Multilevel Converters

Yi Zhang; Huai Wang; Zhongxu Wang; Frede Blaabjerg; Maryam Saeedifard

doi:10.1109/TPEL.2019.2957826

Mission Profile-Based System-Level Reliability Prediction Method for Modular Multilevel Converters

Yi Zhang, Huai Wang, Zhongxu Wang, Frede Blaabjerg, Maryam Saeedifard

Research output: Journal article publication › Journal article › Academic research › peer-review

95 Citations (Scopus)

Abstract

This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

Original language	English
Article number	8926422
Pages (from-to)	6916-6930
Number of pages	15
Journal	IEEE Transactions on Power Electronics
Volume	35
Issue number	7
DOIs	https://doi.org/10.1109/TPEL.2019.2957826
Publication status	Published - 1 Jul 2020
Externally published	Yes

Keywords

Modular multilevel converters (MMCs)
power losses
redundancy
reliability
thermal analysis

ASJC Scopus subject areas

Electrical and Electronic Engineering

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1109/TPEL.2019.2957826

Cite this

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title = "Mission Profile-Based System-Level Reliability Prediction Method for Modular Multilevel Converters",

abstract = "This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.",

keywords = "Modular multilevel converters (MMCs), power losses, redundancy, reliability, thermal analysis",

author = "Yi Zhang and Huai Wang and Zhongxu Wang and Frede Blaabjerg and Maryam Saeedifard",

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AU - Zhang, Yi

AU - Wang, Huai

AU - Wang, Zhongxu

AU - Blaabjerg, Frede

AU - Saeedifard, Maryam

PY - 2020/7/1

Y1 - 2020/7/1

N2 - This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

AB - This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

KW - Modular multilevel converters (MMCs)

KW - power losses

KW - redundancy

KW - reliability

KW - thermal analysis

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DO - 10.1109/TPEL.2019.2957826

M3 - Journal article

AN - SCOPUS:85082300198

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SP - 6916

EP - 6930

JO - IEEE Transactions on Power Electronics

JF - IEEE Transactions on Power Electronics

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Mission Profile-Based System-Level Reliability Prediction Method for Modular Multilevel Converters

Abstract

Keywords

ASJC Scopus subject areas

UN SDGs

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