Miniaturized gas sensor based on silicon substrate-integrated hollow waveguides

Shaonan Zheng, Hong Cai, Linfang Xu, Nanxi Li, Jinjing Fu, Zhonghua Gu, Yao Zhang, Weiguo Chen, Yuxi Cui, Fuu Ming Kai, Lennon Yao Ting Lee

    Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

    3 Citations (Scopus)

    Abstract

    Gas sensors have wide applications including industrial process control, environment monitoring, safety control, etc. The distribution of these sensors enables data generation for the emerging trend of big data and internet of things. In this work, chip-based non-dispersive infrared (NDIR) gas sensors are demonstrated. Silicon substrate-integrated hollow waveguide (Si-iHWG), which is formed through silicon wafer etching and bonding, is used as optical channel and gas cell. A high sensitivity of 50 ppm for CO2 sensing is demonstrated. The Si-iHWG chip-based sensor with compactness, low cost, versatility, and robustness provides a promising platform for miniaturized gas sensing in various application scenarios.

    Original languageEnglish
    Title of host publicationIntegrated Optics
    Subtitle of host publicationDevices, Materials, and Technologies XXV
    EditorsSonia M. Garcia-Blanco, Pavel Cheben
    PublisherSPIE
    ISBN (Electronic)9781510642133
    DOIs
    Publication statusPublished - Mar 2021
    EventIntegrated Optics: Devices, Materials, and Technologies XXV 2021 - Virtual, Online, United States
    Duration: 6 Mar 202111 Mar 2021

    Publication series

    NameProceedings of SPIE - The International Society for Optical Engineering
    Volume11689
    ISSN (Print)0277-786X
    ISSN (Electronic)1996-756X

    Conference

    ConferenceIntegrated Optics: Devices, Materials, and Technologies XXV 2021
    Country/TerritoryUnited States
    CityVirtual, Online
    Period6/03/2111/03/21

    Keywords

    • CO2 sensor
    • hollow waveguide
    • miniaturized gas sensor
    • non-dispersive infrared
    • silicon substrate-integrated
    • silicon wafer wet etching
    • wafer bonding

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Computer Science Applications
    • Applied Mathematics
    • Electrical and Electronic Engineering

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