Microstructure evolution of copper strips with gradient temperature in electropulsing treatment

R. F. Zhu, G. Y. Tang, San-Qiang Shi, Mingwang Fu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

19 Citations (Scopus)


Microstructure evolution of copper strips with gradient temperature between two electrodes in electropulsing treatment is investigated. The cold-rolled copper strips develop recovery and recrystallization between the two electrodes. The gradient temperature caused by the movement of strips in the treatment process results in the evolution of microstructure. The larger temperature gradient distribution caused by the electropulsing treatment with higher frequency, the larger microstructure evolution the copper strips have, indicating the temperature plays an important role in electropulsing treatment.
Original languageEnglish
Pages (from-to)160-165
Number of pages6
JournalJournal of Alloys and Compounds
Publication statusPublished - 1 Jan 2013


  • Crystallization
  • Electropulsing treatment
  • Gradient temperature
  • Microstructure evolution
  • Nucleation

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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