Microstructual analysis of stress relieving on the thermal deformation behaviors of titanium tailor-welded blanks

Chi Ping Lai, Luen Chow Chan

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review


This paper aims to investigate the microstructual analysis of titanium tailor-welded blanks (Ti-TWBs) undergoing the stress relieving (SR) during a thermal deformation. A modified HILLE machine, with a specific heating device that can adjust the working temperature, was employed in this study. Qualified Ti-TWBs specimens were prepared in different widths and lengths. In order to compare the performance of both SR and non-SR Ti-TWBs, the formability analyses at room temperature and around 550degC were then carried out accordingly. The limit dome heights (LDH) of these specimens were measured and it was found that the ductility of the SR Ti-TWBs was improved due to the removal of the hardening effect as well the working stress during the cold working. Moreover, the fracture surface of the Ti-TWBs also revealed that the microstructure was fine and equaxial after the heat treatment. It can be concluded that the microstructual evolution is useful to enhance the strength of Ti-TWBs.
Original languageEnglish
Title of host publicationMicro Nano Devices, Structure and Computing Systems II
Number of pages4
Publication statusPublished - 15 Apr 2013
Event2013 2nd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2013 - Shenzhen, China
Duration: 23 Jan 201324 Jan 2013

Publication series

NameAdvanced Materials Research
ISSN (Print)1022-6680


Conference2013 2nd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2013


  • Microstructual analysis
  • Stress relieving
  • Thermal deformation
  • Titanium tailor-welded blanks

ASJC Scopus subject areas

  • Engineering(all)

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