Micro impact characterisation of solder joint for drop impact application

E. H. Wong; Y. W. Mai; R. Rajoo; K. T. Tsai; F. Liu; S. K.W. Seah; C. L. Yeh

doi:10.1109/ECTC.2006.1645627

Micro impact characterisation of solder joint for drop impact application

E. H. Wong, Y. W. Mai, R. Rajoo, K. T. Tsai, F. Liu, S. K.W. Seah, C. L. Yeh

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

38 Citations (Scopus)

Abstract

Good correlation has been established between high speed shearing of solder joint at component level and board level drop tests, endorsing high speed shearing as a viable quality assurance test for manufacturing and incoming inspection. The high speed shear characteristics of solder joints under different test conditions (shear speed, shear angle, and temperature) and aging conditions (multiple reflow, temperature humidity, and salt spray) have been evaluated. Preliminary S-N characteristic for SnPb_OSP and SnAg_OSP solder joints have been generated using high speed cyclic bends test. These could be devolved into a life prediction model for board level solder joints in product drop impact.

Original language	English
Title of host publication	Proceedings - IEEE 56th Electronic Components and Technology Conference
Pages	64-71
Number of pages	8
DOIs	https://doi.org/10.1109/ECTC.2006.1645627
Publication status	Published - 2006
Externally published	Yes
Event	IEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States Duration: 30 May 2006 → 2 Jun 2006

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2006
ISSN (Print)	0569-5503

Conference

Conference	IEEE 56th Electronic Components and Technology Conference
Country/Territory	United States
City	San Diego, CA
Period	30/05/06 → 2/06/06

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

More information

10.1109/ECTC.2006.1645627

Cite this

Wong, E. H., Mai, Y. W., Rajoo, R., Tsai, K. T., Liu, F., Seah, S. K. W., & Yeh, C. L. (2006). Micro impact characterisation of solder joint for drop impact application. In Proceedings - IEEE 56th Electronic Components and Technology Conference (pp. 64-71). Article 1645627 (Proceedings - Electronic Components and Technology Conference; Vol. 2006). https://doi.org/10.1109/ECTC.2006.1645627

@inproceedings{282cf481c7c04826986354ad0bd70413,

title = "Micro impact characterisation of solder joint for drop impact application",

abstract = "Good correlation has been established between high speed shearing of solder joint at component level and board level drop tests, endorsing high speed shearing as a viable quality assurance test for manufacturing and incoming inspection. The high speed shear characteristics of solder joints under different test conditions (shear speed, shear angle, and temperature) and aging conditions (multiple reflow, temperature humidity, and salt spray) have been evaluated. Preliminary S-N characteristic for SnPb_OSP and SnAg_OSP solder joints have been generated using high speed cyclic bends test. These could be devolved into a life prediction model for board level solder joints in product drop impact.",

author = "Wong, {E. H.} and Mai, {Y. W.} and R. Rajoo and Tsai, {K. T.} and F. Liu and Seah, {S. K.W.} and Yeh, {C. L.}",

year = "2006",

doi = "10.1109/ECTC.2006.1645627",

language = "English",

isbn = "1424401526",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "64--71",

booktitle = "Proceedings - IEEE 56th Electronic Components and Technology Conference",

note = "IEEE 56th Electronic Components and Technology Conference ; Conference date: 30-05-2006 Through 02-06-2006",

}

Wong, EH, Mai, YW, Rajoo, R, Tsai, KT, Liu, F, Seah, SKW & Yeh, CL 2006, Micro impact characterisation of solder joint for drop impact application. in Proceedings - IEEE 56th Electronic Components and Technology Conference., 1645627, Proceedings - Electronic Components and Technology Conference, vol. 2006, pp. 64-71, IEEE 56th Electronic Components and Technology Conference, San Diego, CA, United States, 30/05/06. https://doi.org/10.1109/ECTC.2006.1645627

Micro impact characterisation of solder joint for drop impact application. / Wong, E. H.; Mai, Y. W.; Rajoo, R. et al.
Proceedings - IEEE 56th Electronic Components and Technology Conference. 2006. p. 64-71 1645627 (Proceedings - Electronic Components and Technology Conference; Vol. 2006).

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AB - Good correlation has been established between high speed shearing of solder joint at component level and board level drop tests, endorsing high speed shearing as a viable quality assurance test for manufacturing and incoming inspection. The high speed shear characteristics of solder joints under different test conditions (shear speed, shear angle, and temperature) and aging conditions (multiple reflow, temperature humidity, and salt spray) have been evaluated. Preliminary S-N characteristic for SnPb_OSP and SnAg_OSP solder joints have been generated using high speed cyclic bends test. These could be devolved into a life prediction model for board level solder joints in product drop impact.

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Micro impact characterisation of solder joint for drop impact application

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ASJC Scopus subject areas

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