Method and system for detecting defects in a targeted printed circuit board (PCB) based on an Artificial Intelligence (AI)

  • Kin Man Lam (Inventor)
  • , FUNG, Ka Chun (Inventor)
  • , Lai, Cheung Ming (Inventor)
  • , XUE, Kaiwen (Inventor)
  • , LIN, Kwan Ho (Inventor)
  • , Kam Chuen Yung (Inventor)

Research output: Patents, agreements, assignments and companiesPatents granted

Abstract

The present invention relates to a method 100 and system for detecting defects in a targeted printed circuit board (PCB) based on an Artificial Intelligence (AI) comprising: providing an image input of the targeted PCB into a pre-trained primary neural network 102; extracting a plurality of feature maps from the image input into a pre-determined number of layers based on semantic and spatial information, arranged in a top-down pathway 104; processing at least one pre-determined feature map layer via a pyramid-structured model coupled with a selective feature attention (SF-PSPyramid) 106; passing the processed feature map layer to a Region of Interest (ROI) align for normalisation 108; and outputting and visualising the processed layer through an output layer, wherein, the output layer displaying the result 110 of the defects on the targeted PCB.
Original languageEnglish
Patent numberHK30103701
Filing date8/02/24
Publication statusPublished - 2025

Fingerprint

Dive into the research topics of 'Method and system for detecting defects in a targeted printed circuit board (PCB) based on an Artificial Intelligence (AI)'. Together they form a unique fingerprint.

Cite this