Abstract
The present invention relates to a method 100 and system for detecting defects in a targeted printed circuit board (PCB) based on an Artificial Intelligence (AI) comprising: providing an image input of the targeted PCB into a pre-trained primary neural network 102; extracting a plurality of feature maps from the image input into a pre-determined number of layers based on semantic and spatial information, arranged in a top-down pathway 104; processing at least one pre-determined feature map layer via a pyramid-structured model coupled with a selective feature attention (SF-PSPyramid) 106; passing the processed feature map layer to a Region of Interest (ROI) align for normalisation 108; and outputting and visualising the processed layer through an output layer, wherein, the output layer displaying the result 110 of the defects on the targeted PCB.
| Original language | English |
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| Patent number | HK30103701 |
| Filing date | 8/02/24 |
| Publication status | Published - 2025 |