MEMS capacitive force sensor for use in microassembly

Kar Hang Chu, James K. Mills, William L. Cleghorn

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

10 Citations (Scopus)

Abstract

This paper presents the design and modeling of a MEMS capacitive sensor for use in microassembly processes. Force monitoring is an important aspect in microassembly processes. It can be used to control the movement of the microgripper to properly engage with and release the micropart without physical damages due to excessive force. In this paper, the proposed sensor structure has an overall dimension of 3600 μm × 840 μm × 10 μm and was fabricated using the Micragem fabrication process. A displacement reduction mechanism is incorporated in this sensor design to increase the sensitivity of the sensor. Experimental results showed that a capacitance change of 112.4 fF would result for a 20-μm input displacement.
Original languageEnglish
Title of host publicationProceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
Pages797-802
Number of pages6
DOIs
Publication statusPublished - 30 Sep 2008
Externally publishedYes
Event2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 - Xi'an, China
Duration: 2 Aug 20085 Aug 2008

Conference

Conference2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
Country/TerritoryChina
CityXi'an
Period2/08/085/08/08

Keywords

  • Capacitive
  • Displacement reduction mechanism
  • Force sensor
  • MEMS
  • Microassembly

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Computer Science Applications
  • Electrical and Electronic Engineering

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