MEMS capacitive force sensor for use in microassembly

Kar Hang Chu; James K. Mills; William L. Cleghorn

doi:10.1109/AIM.2008.4601762

MEMS capacitive force sensor for use in microassembly

Kar Hang Chu, James K. Mills, William L. Cleghorn

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

12 Citations (Scopus)

Abstract

This paper presents the design and modeling of a MEMS capacitive sensor for use in microassembly processes. Force monitoring is an important aspect in microassembly processes. It can be used to control the movement of the microgripper to properly engage with and release the micropart without physical damages due to excessive force. In this paper, the proposed sensor structure has an overall dimension of 3600 μm × 840 μm × 10 μm and was fabricated using the Micragem fabrication process. A displacement reduction mechanism is incorporated in this sensor design to increase the sensitivity of the sensor. Experimental results showed that a capacitance change of 112.4 fF would result for a 20-μm input displacement.

Original language	English
Title of host publication	Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
Pages	797-802
Number of pages	6
DOIs	https://doi.org/10.1109/AIM.2008.4601762
Publication status	Published - 30 Sept 2008
Externally published	Yes
Event	2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008 - Xi'an, China Duration: 2 Aug 2008 → 5 Aug 2008

Conference

Conference	2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008
Country/Territory	China
City	Xi'an
Period	2/08/08 → 5/08/08

Keywords

Capacitive
Displacement reduction mechanism
Force sensor
MEMS
Microassembly

ASJC Scopus subject areas

Control and Systems Engineering
Software
Computer Science Applications
Electrical and Electronic Engineering

More information

10.1109/AIM.2008.4601762

Cite this

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Chu, KH, Mills, JK & Cleghorn, WL 2008, MEMS capacitive force sensor for use in microassembly. in Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008., 4601762, pp. 797-802, 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008, Xi'an, China, 2/08/08. https://doi.org/10.1109/AIM.2008.4601762

MEMS capacitive force sensor for use in microassembly. / Chu, Kar Hang; Mills, James K.; Cleghorn, William L.
Proceedings of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2008. 2008. p. 797-802 4601762.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AB - This paper presents the design and modeling of a MEMS capacitive sensor for use in microassembly processes. Force monitoring is an important aspect in microassembly processes. It can be used to control the movement of the microgripper to properly engage with and release the micropart without physical damages due to excessive force. In this paper, the proposed sensor structure has an overall dimension of 3600 μm × 840 μm × 10 μm and was fabricated using the Micragem fabrication process. A displacement reduction mechanism is incorporated in this sensor design to increase the sensitivity of the sensor. Experimental results showed that a capacitance change of 112.4 fF would result for a 20-μm input displacement.

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MEMS capacitive force sensor for use in microassembly

Abstract

Conference

Keywords

ASJC Scopus subject areas

More information

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