Mechanical event simulation of drop testing for toy product

Anthony Yee Kai Yam, Kai Leung Yung, Chi Wo Lam

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review


Toys that are free from drop failures normally take a long time to develop. It is often time and cost consuming after the production tooling is built to detect drop test failure. This paper introduces a new drop testing analysis method for Toys. The method uses a simple approach with a local analysis that based on the linear and non linear finite element analysis. Modeling and transient drop analysis of a pre-school toy is used as a case study to demonstrate the method. The impact analysis of the product hitting the solid concrete floor after a free fall is presented. The analysis focuses on the deformation of the housing for a product with electronic circuit and mechanical mechanism inside. Experimental data has been obtained for drop simulation of the housing and its correlation with the plastic material properties. The stress and strain of the housing during drop impact tests are noted. The effects of the material properties to the housing deflection under drop/impact shock have been investigated. Numerical results are compared with experimental results to validate the method.
Original languageEnglish
Title of host publicationAdvances in Materials Manufacturing Science and Technology II - Selected Papers from the 12th International Manufacturing Conference in China
Number of pages4
Publication statusPublished - 1 Dec 2006
Event12th International Manufacturing Conference in China, IMCC2006 - Xi'an, China
Duration: 21 Sept 200623 Sept 2006

Publication series

NameMaterials Science Forum
ISSN (Print)0255-5476


Conference12th International Manufacturing Conference in China, IMCC2006


  • Contact impact behavior
  • Drop modeling/simulation
  • Drop/impact behavior
  • Finite element analysis method
  • Impact-induced effect
  • Permanent deformation

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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