Low temperature transfer of aligned carbon nanotube films using liftoff technique

Yang Chai, Jingfeng Gong, Kai Zhang, Philip Ching Ho Chan, Matthrew M.F. Yuen

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

14 Citations (Scopus)

Abstract

Carbon nanotubes (CNT) have been proposed for many electronic applications, such as field emitter, diode, transistors, integrated circuit interconnections and thermal interface material (TIM). The growth temperature of high quality CNT typically takes place at high temperatures. The high growth temperature causes significant difficulty in the integration of CNT to the many common material used in electronics, such as, metal, glasses and most polymers. We prepare the high-density aligned CNT film on the silicon/silicon dioxide substrate using a plasma-enhanced chemical vapor deposition (PECVD) method. The aligned CNT film is kept intact after the supporting silicon dioxide layer is removed by hydrofluoric acid (HF) solution. The "lifted off " CNT film can be transferred to various substrates at room temperature. This method avoids the problem caused by the high temperature process, and retains the CNT film quality. Thermal characterization indicates that the resistance of the transferred CNT film is comparable with that of as-grown CNT film. This method can be extended to many electronic applications, such as the fabrication of the field emitter, integrated circuit interconnect and sensors, that require CNT synthesis temperatures not compatible with the substrate material.
Original languageEnglish
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages429-434
Number of pages6
DOIs
Publication statusPublished - 22 Oct 2007
Externally publishedYes
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: 29 May 20071 Jun 2007

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
CountryUnited States
CitySparks, NV
Period29/05/071/06/07

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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