Low temperature superplastic gas pressure forming of electrodeposited Ni/SiCpnanocomposites

Kang Cheung Chan, G. F. Wang, C. L. Wang, K. F. Zhang

Research output: Journal article publicationJournal articleAcademic researchpeer-review

18 Citations (Scopus)

Abstract

The superplastic deformation behavior of a Ni/SiCpnanocomposite was investigated under equibiaxial tension at a strain rate of 8.3 × 10-4s-1and various forming temperatures and die apertures. The average as-deposited nickel grain size was 40 nm, and the average SiC particle size was 50 nm. The experimental relative bulging height (RBH) values were measured, and compared with that predicted by a finite element method (FEM) model. It was found that the composite had exhibited good superplasticity, illustrating high RBH values, and the die diameter affected significantly its deformation behavior. The cavitation behavior of the composite was also examined, and found to be dependent on stress state and the total effective strain. As compared to the analytical results, the FEM predictions were shown to be in better agreement with the experimental thickness distribution, although a large discrepancy was observed for dies with small diameters.
Original languageEnglish
Pages (from-to)108-116
Number of pages9
JournalMaterials Science and Engineering A
Volume404
Issue number1-2
DOIs
Publication statusPublished - 15 Sep 2005

Keywords

  • Bulging
  • Electrodeposition
  • Finite element method
  • Nanocomposites
  • Superplasticity

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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