Abstract
We demonstrated that the bonding of gold wire for COB application was feasible to be done at temperature approximately 100 °C or below by using a wedge bonder with a high frequency ultrasonic transducer (approximately 138 kHz). An automatic rotary bondhead wedge bonder equipped with the transducer was employed to perform wirebonding. Bonding of gold wires was made on the aluminum pads of a test die and gold-plated FR-4 PCB. The deformation of the bonded wire on die pad was as small as 1.2 times the diameter of the bonding wire. This provided a bigger room for bond placement on pad, hence a larger window for very fine pitch application. The defect on bond-heel was found to be less severe due to smaller bond deformation and the softness of gold. In some niche applications where gold wire and very low loop profile were required for the interconnections, wedge bonding of gold wire may be an option. In this article, the characteristics of high frequency ultrasonic transducer, the specifications of gold wire, wedge tool and gold-plated PCB as well as the bonding parameters for the wedge bonder will be discussed in details.
Original language | English |
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Title of host publication | Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium |
Publisher | IEEE |
Pages | 196-202 |
Number of pages | 7 |
ISBN (Print) | 0780355032 |
Publication status | Published - 1 Dec 1999 |
Externally published | Yes |
Event | Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999) - Austin, TX, United States Duration: 18 Oct 1999 → 19 Oct 1999 |
Conference
Conference | Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999) |
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Country/Territory | United States |
City | Austin, TX |
Period | 18/10/99 → 19/10/99 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering