Low temperature gold wire bonding

Y. M. Cheung, Siu Wing Or, Stephen Ching

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

13 Citations (Scopus)


We demonstrated that the bonding of gold wire for COB application was feasible to be done at temperature approximately 100 °C or below by using a wedge bonder with a high frequency ultrasonic transducer (approximately 138 kHz). An automatic rotary bondhead wedge bonder equipped with the transducer was employed to perform wirebonding. Bonding of gold wires was made on the aluminum pads of a test die and gold-plated FR-4 PCB. The deformation of the bonded wire on die pad was as small as 1.2 times the diameter of the bonding wire. This provided a bigger room for bond placement on pad, hence a larger window for very fine pitch application. The defect on bond-heel was found to be less severe due to smaller bond deformation and the softness of gold. In some niche applications where gold wire and very low loop profile were required for the interconnections, wedge bonding of gold wire may be an option. In this article, the characteristics of high frequency ultrasonic transducer, the specifications of gold wire, wedge tool and gold-plated PCB as well as the bonding parameters for the wedge bonder will be discussed in details.
Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
Number of pages7
ISBN (Print)0780355032
Publication statusPublished - 1 Dec 1999
Externally publishedYes
EventProceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999) - Austin, TX, United States
Duration: 18 Oct 199919 Oct 1999


ConferenceProceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999)
Country/TerritoryUnited States
CityAustin, TX

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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