Low-resistance carbon nanotube contact plug to silicon

Yang Chai; Zhiyong Xiao; Philip Ching Ho Chan

doi:10.1109/LED.2009.2024778

Low-resistance carbon nanotube contact plug to silicon

Yang Chai
, Zhiyong Xiao
, Philip Ching Ho Chan

Research output: Journal article publication › Journal article › Academic research › peer-review

10 Citations (Scopus)

Abstract

We demonstrated the integration of carbon nanotubes (CNTs) as the contact plug to the Si MOSFET. A Ti silicide contact layer was introduced between the CNTs and the Si. The open-ended CNT tip connected the metal one on the other end. We study the contact resistivity of the CNT contact plug using the cross-bridge Kelvin test structure, and compare with the W contact plug. The CNT contact plug also showed excellent thermal stability. The electrical and thermal behavior is closely related to the intermediate layer between the CNT and the Si.

Original language	English
Pages (from-to)	811-813
Number of pages	3
Journal	IEEE Electron Device Letters
Volume	30
Issue number	8
DOIs	https://doi.org/10.1109/LED.2009.2024778
Publication status	Published - 14 Jul 2009
Externally published	Yes

Keywords

Carbon nanotube (CNT)
Contacts
Interconnection
Plug

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

More information

10.1109/LED.2009.2024778

Cite this

@article{0b82a42e173a4d539ebf7f4e27290b81,

title = "Low-resistance carbon nanotube contact plug to silicon",

abstract = "We demonstrated the integration of carbon nanotubes (CNTs) as the contact plug to the Si MOSFET. A Ti silicide contact layer was introduced between the CNTs and the Si. The open-ended CNT tip connected the metal one on the other end. We study the contact resistivity of the CNT contact plug using the cross-bridge Kelvin test structure, and compare with the W contact plug. The CNT contact plug also showed excellent thermal stability. The electrical and thermal behavior is closely related to the intermediate layer between the CNT and the Si.",

keywords = "Carbon nanotube (CNT), Contacts, Interconnection, Plug",

author = "Yang Chai and Zhiyong Xiao and Chan, \{Philip Ching Ho\}",

year = "2009",

month = jul,

day = "14",

doi = "10.1109/LED.2009.2024778",

language = "English",

volume = "30",

pages = "811--813",

journal = "IEEE Electron Device Letters",

issn = "0741-3106",

publisher = "IEEE",

number = "8",

}

TY - JOUR

T1 - Low-resistance carbon nanotube contact plug to silicon

AU - Chai, Yang

AU - Xiao, Zhiyong

AU - Chan, Philip Ching Ho

PY - 2009/7/14

Y1 - 2009/7/14

N2 - We demonstrated the integration of carbon nanotubes (CNTs) as the contact plug to the Si MOSFET. A Ti silicide contact layer was introduced between the CNTs and the Si. The open-ended CNT tip connected the metal one on the other end. We study the contact resistivity of the CNT contact plug using the cross-bridge Kelvin test structure, and compare with the W contact plug. The CNT contact plug also showed excellent thermal stability. The electrical and thermal behavior is closely related to the intermediate layer between the CNT and the Si.

AB - We demonstrated the integration of carbon nanotubes (CNTs) as the contact plug to the Si MOSFET. A Ti silicide contact layer was introduced between the CNTs and the Si. The open-ended CNT tip connected the metal one on the other end. We study the contact resistivity of the CNT contact plug using the cross-bridge Kelvin test structure, and compare with the W contact plug. The CNT contact plug also showed excellent thermal stability. The electrical and thermal behavior is closely related to the intermediate layer between the CNT and the Si.

KW - Carbon nanotube (CNT)

KW - Contacts

KW - Interconnection

KW - Plug

UR - https://www.scopus.com/pages/publications/68249149573

U2 - 10.1109/LED.2009.2024778

DO - 10.1109/LED.2009.2024778

M3 - Journal article

SN - 0741-3106

VL - 30

SP - 811

EP - 813

JO - IEEE Electron Device Letters

JF - IEEE Electron Device Letters

IS - 8

ER -

Low-resistance carbon nanotube contact plug to silicon

Abstract

Keywords

ASJC Scopus subject areas

More information

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