Low-Loss 800nm-Thick PECVD Silicon Nitride Photonic Platform on 300-mm Wafer

Hong Cai, Bo Li, Yiding Lin, Haitao Yu, Steven Hou Jang Lee, Chin Khang Tew, Jae Ok Yoo, Charmaine Goh, Shervonne Woon, Doris Keh Ting Ng, Navab Singh, Xianshu Luo, Lennon Yao Ting Lee

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

In this paper we demonstrate the development and optimization of an 800 nm-thick Plasma-enhanced chemical vapor deposition (PECVD) silicon nitride (SiN) photonic platform on a 300-mm silicon wafer. The implementation of ArF immersion lithography contributes to superior manufacturing processes, as it provides excellent critical dimension (CD) uniformity inter- and intra-wafers, make it an optimal platform of production of integrated circuits and nanoscale devices.

Original languageEnglish
Title of host publicationAdvanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII
EditorsGeorg von Freymann, Eva Blasco, Debashis Chanda
PublisherSPIE
ISBN (Electronic)9781510670563
DOIs
Publication statusPublished - Mar 2024
EventAdvanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII 2024 - San Francisco, United States
Duration: 28 Jan 202431 Jan 2024

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume12898
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceAdvanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII 2024
Country/TerritoryUnited States
CitySan Francisco
Period28/01/2431/01/24

Keywords

  • Photonic platform
  • Photonics waveguides
  • Silicon Nitride

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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