Lead-free piezoelectric transducers for microelectronic wirebonding applications

Kin Wing Kwok; T. Lee; S.H. Choy; H.L.W. Chan

doi:10.5772/9944

Lead-free piezoelectric transducers for microelectronic wirebonding applications

Kin Wing Kwok, T. Lee, S.H. Choy, H.L.W. Chan

Research output: Chapter in book / Conference proceeding › Chapter in an edited book (as author) › Academic research

Abstract

In this chapter, the use of (K₀.₄₇₅Na₀.₄₇₅Li₀.₀₅)(Nb₀.₉₂Ta₀.₀₅Sb₀.₀₃)O₃ added with 0.4wt% CeO₂ and 0.4wt% MnO₂ (abbreviated KNLNTS) and 0.885(Bi₀.₅Na₀.₅)TiO₃-0.05(Bi₀.₅K₀.₅)TiO₃-0.015(Bi₀.₅ Li₀.₅)TiO₃-0.05BaTiO₃ (abbreviated as BNKLBT) lead-free piezoelectric ceramics as the driving elements of ultrasonic wirebonding transducers is reported. The fabrication and characterization of the ceramics, in the form of ring, and the wirebonding transducers are presented.

Original language	English
Title of host publication	Piezoelectric ceramics
Publisher	InTech
ISBN (Print)	9789533071220
DOIs	https://doi.org/10.5772/9944
Publication status	Published - 10 May 2010

Keywords

Lead-free piezoelectric transducers

More information

10.5772/9944

http://hdl.handle.net/10397/5986

Cite this

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AU - Lee, T.

AU - Choy, S.H.

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N2 - In this chapter, the use of (K₀.₄₇₅Na₀.₄₇₅Li₀.₀₅)(Nb₀.₉₂Ta₀.₀₅Sb₀.₀₃)O₃ added with 0.4wt% CeO₂ and 0.4wt% MnO₂ (abbreviated KNLNTS) and 0.885(Bi₀.₅Na₀.₅)TiO₃-0.05(Bi₀.₅K₀.₅)TiO₃-0.015(Bi₀.₅ Li₀.₅)TiO₃-0.05BaTiO₃ (abbreviated as BNKLBT) lead-free piezoelectric ceramics as the driving elements of ultrasonic wirebonding transducers is reported. The fabrication and characterization of the ceramics, in the form of ring, and the wirebonding transducers are presented.

AB - In this chapter, the use of (K₀.₄₇₅Na₀.₄₇₅Li₀.₀₅)(Nb₀.₉₂Ta₀.₀₅Sb₀.₀₃)O₃ added with 0.4wt% CeO₂ and 0.4wt% MnO₂ (abbreviated KNLNTS) and 0.885(Bi₀.₅Na₀.₅)TiO₃-0.05(Bi₀.₅K₀.₅)TiO₃-0.015(Bi₀.₅ Li₀.₅)TiO₃-0.05BaTiO₃ (abbreviated as BNKLBT) lead-free piezoelectric ceramics as the driving elements of ultrasonic wirebonding transducers is reported. The fabrication and characterization of the ceramics, in the form of ring, and the wirebonding transducers are presented.

KW - Lead-free piezoelectric transducers

U2 - 10.5772/9944

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M3 - Chapter in an edited book (as author)

SN - 9789533071220

BT - Piezoelectric ceramics

PB - InTech

ER -

Lead-free piezoelectric transducers for microelectronic wirebonding applications

Abstract

Keywords

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