Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission

Ting Ta Chi; Zhenyu Li; Nanxi Li; Hong Cai; Y. M. Tobing Landobasa; Haitao Yu; Senthilkumar Darshini; Jae Ok Yoo; Arvind Sundaram; B. S.S.Chandra Rao; Lennon Y.T. Lee; Wen Lee

doi:10.1109/ECTC51909.2023.00322

Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission

Ting Ta Chi, Zhenyu Li, Nanxi Li, Hong Cai, Y. M. Tobing Landobasa, Haitao Yu, Senthilkumar Darshini, Jae Ok Yoo, Arvind Sundaram, B. S.S.Chandra Rao, Lennon Y.T. Lee, Wen Lee

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

1 Citation (Scopus)

Abstract

We report an efficient approach to integrate semiconductor laser array with photonic integrated circuits (PIC) in an optical transceiver architecture aiming for 1.6 Tbps. Key features including waveguide alignment layer, multi-tip edge coupler, pedestals, alignment marks, and under-bump metallization are used to achieve efficient integration and optical coupling.

Original language	English
Title of host publication	Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1880-1884
Number of pages	5
ISBN (Electronic)	9798350334982
DOIs	https://doi.org/10.1109/ECTC51909.2023.00322
Publication status	Published - Jun 2023
Event	73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States Duration: 30 May 2023 → 2 Jun 2023

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2023-May
ISSN (Print)	0569-5503

Conference

Conference	73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Country/Territory	United States
City	Orlando
Period	30/05/23 → 2/06/23

Keywords

laser diode flip chip bond
muti-tip edge coupler

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

More information

10.1109/ECTC51909.2023.00322

Cite this

Chi, T. T., Li, Z., Li, N., Cai, H., Tobing Landobasa, Y. M., Yu, H., Darshini, S., Yoo, J. O., Sundaram, A., Rao, B. S. S. C., Lee, L. Y. T., & Lee, W. (2023). Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission. In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023 (pp. 1880-1884). (Proceedings - Electronic Components and Technology Conference; Vol. 2023-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC51909.2023.00322

Chi, Ting Ta ; Li, Zhenyu ; Li, Nanxi et al. / Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission. Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 1880-1884 (Proceedings - Electronic Components and Technology Conference).

@inproceedings{e53310fe83eb4e50a312af176e0952f4,

title = "Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission",

abstract = "We report an efficient approach to integrate semiconductor laser array with photonic integrated circuits (PIC) in an optical transceiver architecture aiming for 1.6 Tbps. Key features including waveguide alignment layer, multi-tip edge coupler, pedestals, alignment marks, and under-bump metallization are used to achieve efficient integration and optical coupling.",

keywords = "laser diode flip chip bond, muti-tip edge coupler",

author = "Chi, {Ting Ta} and Zhenyu Li and Nanxi Li and Hong Cai and {Tobing Landobasa}, {Y. M.} and Haitao Yu and Senthilkumar Darshini and Yoo, {Jae Ok} and Arvind Sundaram and Rao, {B. S.S.Chandra} and Lee, {Lennon Y.T.} and Wen Lee",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 73rd IEEE Electronic Components and Technology Conference, ECTC 2023 ; Conference date: 30-05-2023 Through 02-06-2023",

year = "2023",

month = jun,

doi = "10.1109/ECTC51909.2023.00322",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1880--1884",

booktitle = "Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023",

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Chi, TT, Li, Z, Li, N, Cai, H, Tobing Landobasa, YM, Yu, H, Darshini, S, Yoo, JO, Sundaram, A, Rao, BSSC, Lee, LYT & Lee, W 2023, Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission. in Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Proceedings - Electronic Components and Technology Conference, vol. 2023-May, Institute of Electrical and Electronics Engineers Inc., pp. 1880-1884, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, Orlando, United States, 30/05/23. https://doi.org/10.1109/ECTC51909.2023.00322

Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission. / Chi, Ting Ta; Li, Zhenyu; Li, Nanxi et al.
Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 1880-1884 (Proceedings - Electronic Components and Technology Conference; Vol. 2023-May).

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AU - Yu, Haitao

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AB - We report an efficient approach to integrate semiconductor laser array with photonic integrated circuits (PIC) in an optical transceiver architecture aiming for 1.6 Tbps. Key features including waveguide alignment layer, multi-tip edge coupler, pedestals, alignment marks, and under-bump metallization are used to achieve efficient integration and optical coupling.

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Chi TT, Li Z, Li N, Cai H, Tobing Landobasa YM, Yu H et al. Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission. In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 1880-1884. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC51909.2023.00322

Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission

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Keywords

ASJC Scopus subject areas

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