Laser-assisted plating of printed circuit board microvia

E.S.W. Leung; Kam Chuen Yung; Wing Bun Lee

Laser-assisted plating of printed circuit board microvia

E.S.W. Leung, Kam Chuen Yung, Wing Bun Lee

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research

Original language	English
Pages	64-69
Number of pages	6
Publication status	Published - 2000
Event	Annual New & Emerging Technologies for Electronics Packaging and Assembly - Duration: 1 Jan 2000 → …

Conference

Conference	Annual New & Emerging Technologies for Electronics Packaging and Assembly
Period	1/01/00 → …

Cite this

@conference{7f1800c4567844d0a571f4987ea739b1,

title = "Laser-assisted plating of printed circuit board microvia",

author = "E.S.W. Leung and Yung, {Kam Chuen} and Lee, {Wing Bun}",

year = "2000",

language = "English",

pages = "64--69",

note = "Annual New & Emerging Technologies for Electronics Packaging and Assembly ; Conference date: 01-01-2000",

}

Laser-assisted plating of printed circuit board microvia. / Leung, E.S.W.; Yung, Kam Chuen; Lee, Wing Bun.
2000. 64-69 Paper presented at Annual New & Emerging Technologies for Electronics Packaging and Assembly.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research