Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

W. Y. Li; X. P. Zhang; H. B. Qin; Y. W. Mai

doi:10.1016/j.microrel.2017.10.031

Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

W. Y. Li, X. P. Zhang, H. B. Qin, Y. W. Mai

Research output: Journal article publication › Journal article › Academic research › peer-review

20 Citations (Scopus)

Abstract

Joule heating dominated fracture position transition from the interface between the solder and the intermetallic compound (IMC) layer to the solder matrix occurs in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads with a high current density and increasing temperature. The interfacial fracture is triggered by localized-melting of the solder induced by current crowding at grooves of the interfacial IMC grains and driven by the strain mismatch between the solder and the interfacial IMC layer, while fracture in the solder matrix is caused by matrix bulk melting and the constraint effect from the interfacial IMC layer-substrates.

Original language	English
Pages (from-to)	224-227
Number of pages	4
Journal	Microelectronics Reliability
Volume	82
DOIs	https://doi.org/10.1016/j.microrel.2017.10.031
Publication status	Published - Mar 2018
Externally published	Yes

Keywords

Current crowding
Electro-thermal coupled loads
Fracture
Localized-melting
Strain mismatch

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Safety, Risk, Reliability and Quality
Surfaces, Coatings and Films
Electrical and Electronic Engineering

More information

10.1016/j.microrel.2017.10.031

Cite this

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title = "Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads",

abstract = "Joule heating dominated fracture position transition from the interface between the solder and the intermetallic compound (IMC) layer to the solder matrix occurs in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads with a high current density and increasing temperature. The interfacial fracture is triggered by localized-melting of the solder induced by current crowding at grooves of the interfacial IMC grains and driven by the strain mismatch between the solder and the interfacial IMC layer, while fracture in the solder matrix is caused by matrix bulk melting and the constraint effect from the interfacial IMC layer-substrates.",

keywords = "Current crowding, Electro-thermal coupled loads, Fracture, Localized-melting, Strain mismatch",

author = "Li, {W. Y.} and Zhang, {X. P.} and Qin, {H. B.} and Mai, {Y. W.}",

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year = "2018",

month = mar,

doi = "10.1016/j.microrel.2017.10.031",

language = "English",

volume = "82",

pages = "224--227",

journal = "Microelectronics Reliability",

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AU - Li, W. Y.

AU - Zhang, X. P.

AU - Qin, H. B.

AU - Mai, Y. W.

PY - 2018/3

Y1 - 2018/3

N2 - Joule heating dominated fracture position transition from the interface between the solder and the intermetallic compound (IMC) layer to the solder matrix occurs in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads with a high current density and increasing temperature. The interfacial fracture is triggered by localized-melting of the solder induced by current crowding at grooves of the interfacial IMC grains and driven by the strain mismatch between the solder and the interfacial IMC layer, while fracture in the solder matrix is caused by matrix bulk melting and the constraint effect from the interfacial IMC layer-substrates.

AB - Joule heating dominated fracture position transition from the interface between the solder and the intermetallic compound (IMC) layer to the solder matrix occurs in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads with a high current density and increasing temperature. The interfacial fracture is triggered by localized-melting of the solder induced by current crowding at grooves of the interfacial IMC grains and driven by the strain mismatch between the solder and the interfacial IMC layer, while fracture in the solder matrix is caused by matrix bulk melting and the constraint effect from the interfacial IMC layer-substrates.

KW - Current crowding

KW - Electro-thermal coupled loads

KW - Fracture

KW - Localized-melting

KW - Strain mismatch

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DO - 10.1016/j.microrel.2017.10.031

M3 - Journal article

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SN - 0026-2714

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JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -

Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

Abstract

Keywords

ASJC Scopus subject areas

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