Investigations on interface debonding of the particle reinforced metal matrix composites in laser forming

F. R. Liu, Kang Cheung Chan, Chak Yin Tang, J. M. Chen

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

Laser forming is a promising technology to deform the work pieces by thermal stress caused by laser irradiations. Up to date, considerable investigations have been carried out to clarify the process, however, much attention has been focused on monolithic alloys and relatively less work has been done on the MMCs. In the present study, interface debonding of MMCs in laser forming was experimentally and numerically investigated. A microstructure integrated 3D FEM was developed to simulate the deformation behavior of MMCs in laser forming. And a periodic multi-particle cell model was firstly used to determine the damage evolution under uniaxial tensile loading, where the onset of damage was assumed to follow a maximum normal stress criterion. The damage evolution of the MMCs was subsequently coupled to the numerical model to calculate the deformation behavior of the composite in laser forming. It was found that the simulated results were in reasonable good agreement with the experimental data. And some significant findings were discussed in the paper.
Original languageEnglish
Title of host publicationICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
Pages225-232
Number of pages8
Volume102
Publication statusPublished - 1 Dec 2009
Event28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009 - Orlando, FL, United States
Duration: 2 Nov 20095 Nov 2009

Conference

Conference28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009
CountryUnited States
CityOrlando, FL
Period2/11/095/11/09

Keywords

  • Damage evolution
  • Interface debonding
  • Laser forming
  • Metal matrix composite

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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