Investigation on the formation of surface defects of OFHC copper in diamond micro-grooving process

J. D. Han, L. H. Li, C. Y. Chan, Wing Bun Lee

Research output: Journal article publicationJournal articleAcademic researchpeer-review

4 Citations (Scopus)

Abstract

Surface quality plays a vital role in fabricating high-precision components. Taper cutting experiment with increased depth of cut from 0 to 20 μm was conducted on oxygen-free high conductivity (OFHC) copper and C37700 brass workpiece in this paper. It was found that surface delamination phenomenon occurred in diamond micro-grooved surface of OFHC copper workpiece at a depth of cut larger than 11 μm, while there was no delamination being found on brass workpiece. It was suspected that the formation of surface delamination on OFHC copper workpiece was influenced by the plastic deformation and stress state of the material in the subsurface area in diamond micro-machining process.
Original languageEnglish
Pages (from-to)4133-4141
Number of pages9
JournalInternational Journal of Advanced Manufacturing Technology
Volume93
Issue number9-12
DOIs
Publication statusPublished - 1 Dec 2017

Keywords

  • Diamond cutting
  • OFHC copper
  • Sliding wear
  • Surface delamination

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Mechanical Engineering
  • Computer Science Applications
  • Industrial and Manufacturing Engineering

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