Interfacial reactions on annealing Cu/Al multilayer thin films

H. G. Jiang; Jiyan Dai; H. Y. Tong; B. Z. Ding; Q. H. Song; Z. Q. Hu

doi:10.1063/1.355183

Interfacial reactions on annealing Cu/Al multilayer thin films

H. G. Jiang, Jiyan Dai, H. Y. Tong, B. Z. Ding, Q. H. Song, Z. Q. Hu

Research output: Journal article publication › Journal article › Academic research › peer-review

90 Citations (Scopus)

Abstract

Thin film reactions of Cu/Al multilayer films were investigated by differential scanning calorimetry and transmission electron microscopy. Sequential intermetallic compound formation was found in the temperature range from 300 to 620 K. With excess copper present in the as-deposited trilayer and multilayer films, the observed sequence was CuAl2and Cu9Al4, and the interfacial reactions were controlled by interfacial and grain boundary diffusion. The activation energies for the formation of CuAl2and Cu9Al4are 0.78±0.11 and 0.83±0.2 eV, respectively.

Original language	English
Pages (from-to)	6165-6169
Number of pages	5
Journal	Journal of Applied Physics
Volume	74
Issue number	10
DOIs	https://doi.org/10.1063/1.355183
Publication status	Published - 1 Dec 1993
Externally published	Yes

ASJC Scopus subject areas

General Physics and Astronomy

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10.1063/1.355183

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@article{1ee93f95a02e46b193d41f9621e05c27,

title = "Interfacial reactions on annealing Cu/Al multilayer thin films",

abstract = "Thin film reactions of Cu/Al multilayer films were investigated by differential scanning calorimetry and transmission electron microscopy. Sequential intermetallic compound formation was found in the temperature range from 300 to 620 K. With excess copper present in the as-deposited trilayer and multilayer films, the observed sequence was CuAl2and Cu9Al4, and the interfacial reactions were controlled by interfacial and grain boundary diffusion. The activation energies for the formation of CuAl2and Cu9Al4are 0.78±0.11 and 0.83±0.2 eV, respectively.",

author = "Jiang, {H. G.} and Jiyan Dai and Tong, {H. Y.} and Ding, {B. Z.} and Song, {Q. H.} and Hu, {Z. Q.}",

year = "1993",

month = dec,

day = "1",

doi = "10.1063/1.355183",

language = "English",

volume = "74",

pages = "6165--6169",

journal = "Journal of Applied Physics",

issn = "0021-8979",

publisher = "American Institute of Physics",

number = "10",

}

TY - JOUR

T1 - Interfacial reactions on annealing Cu/Al multilayer thin films

AU - Jiang, H. G.

AU - Dai, Jiyan

AU - Tong, H. Y.

AU - Ding, B. Z.

AU - Song, Q. H.

AU - Hu, Z. Q.

PY - 1993/12/1

Y1 - 1993/12/1

N2 - Thin film reactions of Cu/Al multilayer films were investigated by differential scanning calorimetry and transmission electron microscopy. Sequential intermetallic compound formation was found in the temperature range from 300 to 620 K. With excess copper present in the as-deposited trilayer and multilayer films, the observed sequence was CuAl2and Cu9Al4, and the interfacial reactions were controlled by interfacial and grain boundary diffusion. The activation energies for the formation of CuAl2and Cu9Al4are 0.78±0.11 and 0.83±0.2 eV, respectively.

AB - Thin film reactions of Cu/Al multilayer films were investigated by differential scanning calorimetry and transmission electron microscopy. Sequential intermetallic compound formation was found in the temperature range from 300 to 620 K. With excess copper present in the as-deposited trilayer and multilayer films, the observed sequence was CuAl2and Cu9Al4, and the interfacial reactions were controlled by interfacial and grain boundary diffusion. The activation energies for the formation of CuAl2and Cu9Al4are 0.78±0.11 and 0.83±0.2 eV, respectively.

UR - http://www.scopus.com/inward/record.url?scp=0005649053&partnerID=8YFLogxK

U2 - 10.1063/1.355183

DO - 10.1063/1.355183

M3 - Journal article

SN - 0021-8979

VL - 74

SP - 6165

EP - 6169

JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 10

ER -

Interfacial reactions on annealing Cu/Al multilayer thin films

Abstract

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