Interfacial engineering of printable bottom back metal electrodes for full-solution processed flexible organic solar cells

Hongyu Zhen, Kan Li, Yaokang Zhang, Lina Chen, Liyong Niu, Xiaoling Wei, Xu Fang, Peng You, Zhike Liu, Dongrui Wang, Feng Yan, Zijian Zheng

Research output: Journal article publicationJournal articleAcademic researchpeer-review

6 Citations (Scopus)

Abstract

Printing of metal bottom back electrodes of flexible organic solar cells (FOSCs) at low temperature is of great significance to realize the full-solution fabrication technology. However, this has been difficult to achieve because often the interfacial properties of those printed electrodes, including conductivity, roughness, work function, optical and mechanical flexibility, cannot meet the device requirement at the same time. In this work, we fabricate printed Ag and Cu bottom back cathodes by a low-temperature solution technique named polymer-assisted metal deposition (PAMD) on flexible PET substrates. Branched polyethylenimine (PEI) and ZnO thin films are used as the interface modification layers (IMLs) of these cathodes. Detailed experimental studies on the electrical, mechanical, and morphological properties, and simulation study on the optical properties of these IMLs are carried out to understand and optimize the interface of printed cathodes. We demonstrate that the highest power conversion efficiency over 3.0% can be achieved from a full-solution processed OFSC with the device structure being PAMD-Ag/PEI/P3HT:PC61BM/PH1000. This device also acquires remarkable stability upon repeating bending tests.
Original languageEnglish
Article number014002
JournalJournal of Semiconductors
Volume39
Issue number1
DOIs
Publication statusPublished - 1 Jan 2018

Keywords

  • flexible organic solar cells
  • full-solution processed
  • interface modification layers
  • polymer-assisted metal deposition
  • printed electrodes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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