Interfacial bonding behaviour of embedded SMA wire in smart composites. Micro-scale observation

K.T. Lau, W.L. Chan, San-Qiang Shi, Li Min Zhou

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Original languageEnglish
Pages (from-to)265-270
Number of pages6
JournalMaterials and Design
Publication statusPublished - 2002

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Science(all)

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