Interdiffusion coefficients of various cobalt base alloy coatings for Cu/Au system

C. L. Siu, Hau Chung Man, C. H. Yeung

Research output: Journal article publicationJournal articleAcademic researchpeer-review

3 Citations (Scopus)

Abstract

The interdiffusion coefficients of electrodeposited Co-Mo, Co-P, Co-Mo-P with Cu substrate were studied at temperature ranging from 400 to 800°C, by micro-profiling method using energy dispersive X-ray spectroscopy (EDS). Chemical interdiffusion coefficients were derived using the Boltzmann-Matano method. At 400-500°C, the interdiffusion coefficients for Cu/Co-P couples have the same order of magnitude as the Cu/Co-Mo couples. It was found that the interdiffusion coefficients for nickel are higher than that of the cobalt base alloys. The Co-Mo coating becomes poor in term of barrier property when the temperature is above 700°C.
Original languageEnglish
Pages (from-to)79-86
Number of pages8
JournalApplied Surface Science
Volume245
Issue number1-4
DOIs
Publication statusPublished - 30 May 2005

Keywords

  • Amorphous coating
  • Barrier coating
  • Electroplating
  • Interdiffusion coefficients
  • Nickel ion release

ASJC Scopus subject areas

  • Surfaces, Coatings and Films

Fingerprint

Dive into the research topics of 'Interdiffusion coefficients of various cobalt base alloy coatings for Cu/Au system'. Together they form a unique fingerprint.

Cite this