Intelligent process design system for the transfer moulding of electronic packages

K. W. Tong, Chun Kit Kwong, Kai Ming Yu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

28 Citations (Scopus)

Abstract

Currently, mould design and the setting of the process parameters of transfer moulding for electronic packages are done manually in a trial-and-error manner. The effectiveness of the setting of parameters is largely dependent on the experience of engineers. The paper describes an intelligent process design system for transfer moulding of electronic packages that is used to determine optimal mould design parameters and the setting of the process parameters mainly based on case-based reasoning, artificial neural networks and a multiobjective optimization scheme. The system consists of two modules: a case-based reasoning module and a process optimization module. The former module is used to determine initial mould design parameters and the setting of the process parameters while the latter module is used to determine optimal mould design parameters and the setting of the process parameters. Implementation of the intelligent system has demonstrated that the time for the determination of optimal mould design parameters and the setting of the process parameters can be greatly reduced, and the setting of parameters recommended by the system can contribute to the good quality of moulded packages.
Original languageEnglish
Pages (from-to)1911-1931
Number of pages21
JournalInternational Journal of Production Research
Volume42
Issue number10
DOIs
Publication statusPublished - 15 May 2004

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Management Science and Operations Research

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