Ink-jet printed high conductive silver traces on polymer substrates sintered at room temperature by a camera flash lamp

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

A simple and facile camera flash sintering method has been developed to sinter the ink-jet printed silver nanoparticle traces at room temperature to form conductive circuit on flexible polymer substrates. The electrical resistivity of silver traces sintered by two times of camera flash can be decreased to 8.4 μΩ cm, which is only about 1/3 that of the silver tracks thermally sintered at 150 °C for 80min. As camera flash sintering is fast, simple and cost-effective, it is promising to be widely used for nanoink-jet printed electronics. Furthermore, this method is expected be readily generalized to prepare other types of metal lines on various substrates such as glass and polymer owing to the room temperature process. The sintering mechanism is also investigated via in-situ recording temperature of the Ag nanoparticles based track during the flash sintering, which confirms the enhanced photothermal effect of nanostructures.
Original languageEnglish
Title of host publication16th International Conference on Electronic Packaging Technology, ICEPT 2015
PublisherIEEE
Pages642-644
Number of pages3
ISBN (Electronic)9781467379991
DOIs
Publication statusPublished - 1 Sep 2015
Event16th International Conference on Electronic Packaging Technology, ICEPT 2015 - Vaya International Hotel, Changsha, China
Duration: 11 Aug 201514 Aug 2015

Conference

Conference16th International Conference on Electronic Packaging Technology, ICEPT 2015
Country/TerritoryChina
CityChangsha
Period11/08/1514/08/15

Keywords

  • camera flash sintering
  • conductive circuits
  • flexible substrate
  • ink-jet printing
  • silver nanoparticles

ASJC Scopus subject areas

  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Electrical and Electronic Engineering

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