Initial process-parameters setting of transfer moulding in microchip encapsulation: A case-based reasoning approach

K. W. Tong, Chun Kit Kwong, Ching Yuen Chan

Research output: Journal article publicationConference articleAcademic researchpeer-review

9 Citations (Scopus)

Abstract

Microchip encapsulation based on transfer moulding is one of the important processes of semiconductor manufacturing. This process involves numerous elements working together in order to produce a quality moulded product. Among all of these elements, process-parameters setting of transfer moulding in microchip encapsulation plays a vital role. Determination of the initial process-parameters for transfer moulding in microchip encapsulation is a highly skilled job, based on a skilled operators "know-how" and intuitive sense acquired through long-term experience rather than on a theoretical and analytical approach. Faced with global competition, the current trial-and-error practice in the determination of the initial process-parameters becomes inadequate. In this paper, an artificial intelligence technique, case-based reasoning, is introduced in the process-parameters setting of transfer moulding in microchip encapsulation, from which a case-based system has been developed. The system aims to suggest the proper initial process-parameters of transfer moulding and improve its own moulding know-how through a learning process. The system was implemented and validated in collaboration with a semiconductor equipment manufacturer. From the validation results, it was found that the process-parameters obtained from the case-based system are very close to those obtained from the company.
Original languageEnglish
Pages (from-to)432-438
Number of pages7
JournalJournal of Materials Processing Technology
Volume113
Issue number1-3
DOIs
Publication statusPublished - 15 Jun 2001
Event5th Asia Pacific Conference on Materials Processing - Seoul, Korea, Republic of
Duration: 25 Jun 200125 Jun 2001

Keywords

  • Case-based reasoning
  • Fuzzy retrieval
  • Microchip encapsulation
  • Process-parameters setting
  • Transfer moulding

ASJC Scopus subject areas

  • Ceramics and Composites
  • Modelling and Simulation
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

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