Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps

Jian Cai; Simon Law; Annette Teng; Philip Ching Ho Chan

doi:10.1109/EMAP.2000.904138

Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps

Jian Cai, Simon Law, Annette Teng, Philip Ching Ho Chan

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

12 Citations (Scopus)

Abstract

The bumping process plays a critical role in flip chip technology. A low cost bumping process has been developed using electroless nickel and immersion gold followed by stencil printing. The process flow is described in this paper. The Al pad size is about 100μm in diameter with a pitch of 400pm. Different electroless plating solutions were evaluated as well as different solder pastes were used to evaluate the stencil printing process. Also different pad shapes were tested for shear strength. Ni studs with no bump material were fabricated to evaluate the electroless process. The shear force test result shows a strength value of 230MPa for Ni stud. The solder bump after reflow has a diameter of 160μm and a height of 120μm. There is some difference in the shear force test results for different pad shapes. SEM and ED AX results of the fracture surface indicate that the fracture was cohesive or inside the solder. Cross sections showed some intermetallic layers at the interface. A Ni-Sn intermetallic layer and a phosphorus rich layer formed during reflow, which has a composition of Ni3Sn4 and Ni3P respectively. The low cost flip chip samples were subjected to multiple reflows and shear force tests were performed. Fracture surfaces were analysed and failure modes were differentiated.

Original language	English
Title of host publication	International Symposium on Electronic Materials and Packaging, EMAP 2000
Publisher	IEEE
Pages	91-98
Number of pages	8
ISBN (Electronic)	0780366549, 9780780366541
DOIs	https://doi.org/10.1109/EMAP.2000.904138
Publication status	Published - 1 Jan 2000
Externally published	Yes
Event	International Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, Hong Kong Duration: 30 Nov 2000 → 2 Dec 2000

Conference

Conference	International Symposium on Electronic Materials and Packaging, EMAP 2000
Country/Territory	Hong Kong
City	Hong Kong
Period	30/11/00 → 2/12/00

ASJC Scopus subject areas

General Engineering

More information

10.1109/EMAP.2000.904138

Cite this

@inproceedings{da300caa1b764ee29ee00b14a8e7e1e4,

title = "Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps",

abstract = "The bumping process plays a critical role in flip chip technology. A low cost bumping process has been developed using electroless nickel and immersion gold followed by stencil printing. The process flow is described in this paper. The Al pad size is about 100μm in diameter with a pitch of 400pm. Different electroless plating solutions were evaluated as well as different solder pastes were used to evaluate the stencil printing process. Also different pad shapes were tested for shear strength. Ni studs with no bump material were fabricated to evaluate the electroless process. The shear force test result shows a strength value of 230MPa for Ni stud. The solder bump after reflow has a diameter of 160μm and a height of 120μm. There is some difference in the shear force test results for different pad shapes. SEM and ED AX results of the fracture surface indicate that the fracture was cohesive or inside the solder. Cross sections showed some intermetallic layers at the interface. A Ni-Sn intermetallic layer and a phosphorus rich layer formed during reflow, which has a composition of Ni3Sn4 and Ni3P respectively. The low cost flip chip samples were subjected to multiple reflows and shear force tests were performed. Fracture surfaces were analysed and failure modes were differentiated.",

author = "Jian Cai and Simon Law and Annette Teng and Chan, {Philip Ching Ho}",

year = "2000",

month = jan,

day = "1",

doi = "10.1109/EMAP.2000.904138",

language = "English",

pages = "91--98",

booktitle = "International Symposium on Electronic Materials and Packaging, EMAP 2000",

publisher = "IEEE",

address = "United States",

note = "International Symposium on Electronic Materials and Packaging, EMAP 2000 ; Conference date: 30-11-2000 Through 02-12-2000",

}

Cai, J, Law, S, Teng, A & Chan, PCH 2000, Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps. in International Symposium on Electronic Materials and Packaging, EMAP 2000., 904138, IEEE, pp. 91-98, International Symposium on Electronic Materials and Packaging, EMAP 2000, Hong Kong, Hong Kong, 30/11/00. https://doi.org/10.1109/EMAP.2000.904138

Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps. / Cai, Jian; Law, Simon; Teng, Annette et al.
International Symposium on Electronic Materials and Packaging, EMAP 2000. IEEE, 2000. p. 91-98 904138.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

TY - GEN

T1 - Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps

AU - Cai, Jian

AU - Law, Simon

AU - Teng, Annette

AU - Chan, Philip Ching Ho

PY - 2000/1/1

Y1 - 2000/1/1

N2 - The bumping process plays a critical role in flip chip technology. A low cost bumping process has been developed using electroless nickel and immersion gold followed by stencil printing. The process flow is described in this paper. The Al pad size is about 100μm in diameter with a pitch of 400pm. Different electroless plating solutions were evaluated as well as different solder pastes were used to evaluate the stencil printing process. Also different pad shapes were tested for shear strength. Ni studs with no bump material were fabricated to evaluate the electroless process. The shear force test result shows a strength value of 230MPa for Ni stud. The solder bump after reflow has a diameter of 160μm and a height of 120μm. There is some difference in the shear force test results for different pad shapes. SEM and ED AX results of the fracture surface indicate that the fracture was cohesive or inside the solder. Cross sections showed some intermetallic layers at the interface. A Ni-Sn intermetallic layer and a phosphorus rich layer formed during reflow, which has a composition of Ni3Sn4 and Ni3P respectively. The low cost flip chip samples were subjected to multiple reflows and shear force tests were performed. Fracture surfaces were analysed and failure modes were differentiated.

AB - The bumping process plays a critical role in flip chip technology. A low cost bumping process has been developed using electroless nickel and immersion gold followed by stencil printing. The process flow is described in this paper. The Al pad size is about 100μm in diameter with a pitch of 400pm. Different electroless plating solutions were evaluated as well as different solder pastes were used to evaluate the stencil printing process. Also different pad shapes were tested for shear strength. Ni studs with no bump material were fabricated to evaluate the electroless process. The shear force test result shows a strength value of 230MPa for Ni stud. The solder bump after reflow has a diameter of 160μm and a height of 120μm. There is some difference in the shear force test results for different pad shapes. SEM and ED AX results of the fracture surface indicate that the fracture was cohesive or inside the solder. Cross sections showed some intermetallic layers at the interface. A Ni-Sn intermetallic layer and a phosphorus rich layer formed during reflow, which has a composition of Ni3Sn4 and Ni3P respectively. The low cost flip chip samples were subjected to multiple reflows and shear force tests were performed. Fracture surfaces were analysed and failure modes were differentiated.

UR - http://www.scopus.com/inward/record.url?scp=84954219534&partnerID=8YFLogxK

U2 - 10.1109/EMAP.2000.904138

DO - 10.1109/EMAP.2000.904138

M3 - Conference article published in proceeding or book

SP - 91

EP - 98

BT - International Symposium on Electronic Materials and Packaging, EMAP 2000

PB - IEEE

T2 - International Symposium on Electronic Materials and Packaging, EMAP 2000

Y2 - 30 November 2000 through 2 December 2000

ER -

Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps

Abstract

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