INFLUENCE OF THIN FILM MICROSTRUCTURE ON SURFACE ACOUSTIC WAVE VELOCITY.

G. M. Crean; Michael Geoffrey Somekh; A. Golanski; J. C. Oberlin

INFLUENCE OF THIN FILM MICROSTRUCTURE ON SURFACE ACOUSTIC WAVE VELOCITY.

G. M. Crean, Michael Geoffrey Somekh, A. Golanski, J. C. Oberlin

Research output: Journal article publication › Conference article › Academic research › peer-review

Abstract

Experimental surface acoustic wave velocity dispersion data are reported which were obtained from thin-film tungsten silicide layers (500-2500 angstrom) cosputtered on single-crystal silicon wavers, as a function of various thermal processing treatments. The velocity dispersion data were determined, using an acoustic microscope operating at 375 MHz, by the acoustic material signature (AMS) technique. Transmission electron microscopy and X-ray diffraction analysis were used to characterize the microstructure of these thin films. Simple mathematical expressions for the transmission of a surface wave along a varying polycrystalline structure were used to interrupt the experimental data; the approximate model thus developed makes it possible to access the interface conditions between grains in the material.

Original language	English
Pages (from-to)	843-847
Number of pages	5
Journal	Ultrasonics Symposium Proceedings
Publication status	Published - 1 Dec 1987
Externally published	Yes
Event	IEEE 1987 Ultrasonics Symposium, Proceedings. - Denver, CO, United States Duration: 1 Dec 1987 → …

ASJC Scopus subject areas

General Engineering

Cite this

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title = "INFLUENCE OF THIN FILM MICROSTRUCTURE ON SURFACE ACOUSTIC WAVE VELOCITY.",

abstract = "Experimental surface acoustic wave velocity dispersion data are reported which were obtained from thin-film tungsten silicide layers (500-2500 angstrom) cosputtered on single-crystal silicon wavers, as a function of various thermal processing treatments. The velocity dispersion data were determined, using an acoustic microscope operating at 375 MHz, by the acoustic material signature (AMS) technique. Transmission electron microscopy and X-ray diffraction analysis were used to characterize the microstructure of these thin films. Simple mathematical expressions for the transmission of a surface wave along a varying polycrystalline structure were used to interrupt the experimental data; the approximate model thus developed makes it possible to access the interface conditions between grains in the material.",

author = "Crean, {G. M.} and Somekh, {Michael Geoffrey} and A. Golanski and Oberlin, {J. C.}",

year = "1987",

month = dec,

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language = "English",

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journal = "Ultrasonics Symposium Proceedings",

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note = "IEEE 1987 Ultrasonics Symposium, Proceedings. ; Conference date: 01-12-1987",

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T1 - INFLUENCE OF THIN FILM MICROSTRUCTURE ON SURFACE ACOUSTIC WAVE VELOCITY.

AU - Crean, G. M.

AU - Somekh, Michael Geoffrey

AU - Golanski, A.

AU - Oberlin, J. C.

PY - 1987/12/1

Y1 - 1987/12/1

N2 - Experimental surface acoustic wave velocity dispersion data are reported which were obtained from thin-film tungsten silicide layers (500-2500 angstrom) cosputtered on single-crystal silicon wavers, as a function of various thermal processing treatments. The velocity dispersion data were determined, using an acoustic microscope operating at 375 MHz, by the acoustic material signature (AMS) technique. Transmission electron microscopy and X-ray diffraction analysis were used to characterize the microstructure of these thin films. Simple mathematical expressions for the transmission of a surface wave along a varying polycrystalline structure were used to interrupt the experimental data; the approximate model thus developed makes it possible to access the interface conditions between grains in the material.

AB - Experimental surface acoustic wave velocity dispersion data are reported which were obtained from thin-film tungsten silicide layers (500-2500 angstrom) cosputtered on single-crystal silicon wavers, as a function of various thermal processing treatments. The velocity dispersion data were determined, using an acoustic microscope operating at 375 MHz, by the acoustic material signature (AMS) technique. Transmission electron microscopy and X-ray diffraction analysis were used to characterize the microstructure of these thin films. Simple mathematical expressions for the transmission of a surface wave along a varying polycrystalline structure were used to interrupt the experimental data; the approximate model thus developed makes it possible to access the interface conditions between grains in the material.

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M3 - Conference article

SN - 0090-5607

SP - 843

EP - 847

JO - Ultrasonics Symposium Proceedings

JF - Ultrasonics Symposium Proceedings

T2 - IEEE 1987 Ultrasonics Symposium, Proceedings.

Y2 - 1 December 1987

ER -

INFLUENCE OF THIN FILM MICROSTRUCTURE ON SURFACE ACOUSTIC WAVE VELOCITY.

Abstract

ASJC Scopus subject areas

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