Influence of substrate bias on the structure and properties of (Ti,Al)N films deposited by filtered cathodic vacuum arc

Y. H. Cheng, B. K. Tay, Shu Ping Lau, X. Shi

Research output: Journal article publicationJournal articleAcademic researchpeer-review

29 Citations (Scopus)

Abstract

Cathodic vacuum arc deposition in (Ti,Al)N films was carried out and the effect of negative substrate bias on the mechanical properties of the films was studied. The internal stress, crystal structure, microhardness and Young's Modulus of the films were evaluated. The deposition rate decreased linearly with increasing substrate bias. The films were amorphous and porous at 0 gate bias due to low internal stress. Increased substrate bias caused film densification and decreased defect density in the films, improving their hardness and other mechanical properties.
Original languageEnglish
Pages (from-to)736-742
Number of pages7
JournalJournal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films
Volume19
Issue number3
DOIs
Publication statusPublished - 1 May 2001
Externally publishedYes

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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