Influence of substrate bias on the microstructure and internal stress in Cu films deposited by filtered cathodic vacuum arc

Keyphrases

• Microstructure 100%
• Filtered Cathodic Vacuum Arc 100%
• Internal Stress 100%
• Substrate Bias 100%
• Cu Film 100%
• Morphological Structure 66%
• Grain Size 66%
• Surface Morphology 66%
• Surface Roughness 33%
• X Ray Diffraction 33%
• Atomic Force Microscopy 33%
• Ambient Temperature 33%
• Crystalline Structure 33%
• Arc Technique 33%
• Film Structure 33%
• Film Surface 33%
• Preferred Orientation Growth 33%
• Copper Film 33%
• Off-plane 33%
• Face-centered Cubic 33%
• Diffraction Force 33%
• Surface Grain 33%
• Crystallite Structure 33%

Engineering

• Substrate Bias 100%
• Cu Film 100%
• Internal Stress 100%
• Surface Morphology 66%
• Face-Centered Cubic 33%
• Ray Diffraction 33%
• Copper Deposits 33%
• Atomic Force Microscopy 33%
• Preferred Orientation 33%
• Crystal Structure 33%
• Crystallite 33%

Material Science

• Film 100%
• Surface Morphology 66%
• Grain Size 66%
• Surface Roughness 33%
• X-Ray Diffraction 33%
• Atomic Force Microscopy 33%
• Crystal Structure 33%
• Crystallite 33%