Influence of deposition parameters and kinetics of electroless Ni-P plating on polyester fiber

R. H. Guo, Shou-xiang Kinor Jiang, C. W M Yuen, Man Ching Frankie Ng, J. W. Lan, G. H. Zheng

Research output: Journal article publicationJournal articleAcademic researchpeer-review

13 Citations (Scopus)

Abstract

The electroless nickel-phosphorous (Ni-P) plating on polyester fiber using sodium hypophosphite as a reducing agent in alkaline medium was studied. The effects of plating parameters including concentrations, pH and bath temperature of the plating bath on deposition rate of the electroless Ni-P plating were investigated. The results reveal that the deposition rates increase with the increase in the concentration of nickel sulfate, sodium hypophosphite, pH and bath temperature, respectively. However, it is determined that the deposition rates decrease with the rise of sodium citrate. The kinetics of the deposition reaction was investigated and an empirical rate equation for electroless Ni-P plating on polyester fiber was developed.
Original languageEnglish
Pages (from-to)1037-1043
Number of pages7
JournalFibers and Polymers
Volume13
Issue number8
DOIs
Publication statusPublished - 1 Oct 2012

Keywords

  • Deposition parameter
  • Electroless Ni-P plating
  • Kinetics
  • Polyester fiber

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Chemistry(all)
  • Polymers and Plastics

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