Abstract
The electroless nickel-phosphorous (Ni-P) plating on polyester fiber using sodium hypophosphite as a reducing agent in alkaline medium was studied. The effects of plating parameters including concentrations, pH and bath temperature of the plating bath on deposition rate of the electroless Ni-P plating were investigated. The results reveal that the deposition rates increase with the increase in the concentration of nickel sulfate, sodium hypophosphite, pH and bath temperature, respectively. However, it is determined that the deposition rates decrease with the rise of sodium citrate. The kinetics of the deposition reaction was investigated and an empirical rate equation for electroless Ni-P plating on polyester fiber was developed.
Original language | English |
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Pages (from-to) | 1037-1043 |
Number of pages | 7 |
Journal | Fibers and Polymers |
Volume | 13 |
Issue number | 8 |
DOIs | |
Publication status | Published - 1 Oct 2012 |
Keywords
- Deposition parameter
- Electroless Ni-P plating
- Kinetics
- Polyester fiber
ASJC Scopus subject areas
- General Chemical Engineering
- General Chemistry
- Polymers and Plastics