Abstract
The ability to generate stressed semiconductor particles is of great importance in the development of tunable semiconductor and photonic devices. However, existing methods including both bottom-up synthesis and top-down fabrication for producing semiconductor particles are inherently free of stress effects. Here, we report a simple approach to generate controllable stress effects on both encapsulated and free-standing semiconductor particles using laser-structured in-fiber materials engineering. The physical mechanism of thermally induced in-fiber built-in stress is investigated, and the feasibility of precisely tuning the stress state during the particle formation is experimentally demonstrated by controlling the laser treatment. Gigapascal-level built-in stress, which is a sufficiently strong stimulus to enable inelastic deformations on the fabricated semiconductor particles, has been achieved via this approach. Both encapsulated and free-standing stressed semiconductor particles are generated for a wide range of in-fiber and out-fiber optoelectronic and biomedical applications.
| Original language | English |
|---|---|
| Pages (from-to) | 45330-45337 |
| Number of pages | 8 |
| Journal | ACS Applied Materials and Interfaces |
| Volume | 11 |
| Issue number | 48 |
| DOIs | |
| Publication status | Published - Nov 2019 |
Keywords
- built-in stress control
- in-fiber materials engineering
- laser cooling rate
- residual stress
- stressed semiconductor particles
ASJC Scopus subject areas
- General Materials Science