Improving the reliability of embedded systems with cache and SPM

Wang Meng, Wang Yi, Liu Duo, Shao Zili

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

6 Citations (Scopus)

Abstract

In this paper, we develop a compiler-assisted thermal-aware data allocation algorithm to improve the reliability of embedded systems with cache and SPM (Scratch-pad Memory). Our basic idea is to distribute the workload evenly between the cache and SPM in order to alleviate the temperature hot spots in the on-chip memory system. In the algorithm, considering the size of SPM, we first divide the loop iterations into two parts, and put the accessed data of the first part into SPM. Then we perform code transformation based on the partitioning ofiterations. By alternatively using the data cache and SPM, the peak temperature is reduced. We implement our technique and simulate them using the Trimaran infrastructure with power models for cache and SPM, and the thermal simulator, HotSpot, on a set of benchmarks from DSPstone and MiBench. The experimental results show that our technique can significantly improve the reliability of the on-chip memory system.
Original languageEnglish
Title of host publication2009 IEEE 6th International Conference on Mobile Adhoc and Sensor Systems, MASS '09
Pages825-830
Number of pages6
DOIs
Publication statusPublished - 1 Dec 2009
Event2009 IEEE 6th International Conference on Mobile Adhoc and Sensor Systems, MASS '09 - Macau, China
Duration: 12 Oct 200915 Oct 2009

Conference

Conference2009 IEEE 6th International Conference on Mobile Adhoc and Sensor Systems, MASS '09
CountryChina
CityMacau
Period12/10/0915/10/09

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Software
  • Electrical and Electronic Engineering

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