Improving diamond-metal adhesion with graded TiCN interlayers

Chang Q. Sun, Y. Q. Fu, B. B. Yan, J. H. Hsieh, Shu Ping Lau, X. W. Sun, B. K. Tay

Research output: Journal article publicationJournal articleAcademic researchpeer-review

24 Citations (Scopus)

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Keyphrases

Engineering

Material Science

Physics