Improving diamond-metal adhesion with graded TiCN interlayers

Chang Q. Sun, Y. Q. Fu, B. B. Yan, J. H. Hsieh, Shu Ping Lau, X. W. Sun, B. K. Tay

Research output: Journal article publicationJournal articleAcademic researchpeer-review

22 Citations (Scopus)

Abstract

An approach improving diamond-metal adhesion has been developed based on modeling predictions and experimental verifications on the interfacial stresses modified by catalytic reaction. It is found that N-plasma irradiating onto Ti and tungsten-carbide substrates generates tensile surface stresses while C-plasma irradiation creates strongly compressive stress at the surfaces, both of which deteriorate the diamond-metal adhesion. It is also found that surface oxidation prevents diamond nucleation. Therefore, we applied a graded TiCN interlayer with carefully adjusting the ratio of C and N in the gas mixture to neutralize the interfacial stress and, hence, we have improved the diamond-metal adhesion substantially.
Original languageEnglish
Pages (from-to)2051-2054
Number of pages4
JournalJournal of Applied Physics
Volume91
Issue number4
DOIs
Publication statusPublished - 1 Feb 2002
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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