Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

W. Q. Qiu, Z. W. Liu, L. X. He, D. C. Zeng, Y. W. Mai

Research output: Journal article publication › Journal article › Academic research › peer-review

43 Citations (Scopus)

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Keyphrases

Engineering

Material Science

Chemical Engineering