Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer
- W. Q. Qiu
- , Z. W. Liu
- , L. X. He
- , D. C. Zeng
- , Y. W. Mai
Research output: Journal article publication › Journal article › Academic research › peer-review
44
Link opens in a new tab
Citations
(Scopus)