Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

W. Q. Qiu; Z. W. Liu; L. X. He; D. C. Zeng; Y. W. Mai

doi:10.1016/j.matlet.2012.05.015

Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

W. Q. Qiu, Z. W. Liu, L. X. He, D. C. Zeng, Y. W. Mai

Research output: Journal article publication › Journal article › Academic research › peer-review

43 Citations (Scopus)

Abstract

Large area diamond films were successfully fabricated on copper (Cu) substrates by first electroplating a Cu-diamond composite layer with a tiny amount (0.05-0.1 wt.%) of chromium (Cr) in Cu and then growing the continuous diamond film on the composite interlayer by hot-filament chemical vapor deposition (HFCVD). The interfacial characteristics were investigated in detail by scanning electron microscopy and indentation test. The results show that using this new approach, the diamond coating could be firmly adhered to the substrate during rapid cooling after HFCVD. Doping Cr into the Cu-diamond composite interlayer and anchoring the diamond particles deep in the Cu(Cr) matrix are responsible for the much improved interface adhesion between coating and substrate.

Original language	English
Pages (from-to)	155-157
Number of pages	3
Journal	Materials Letters
Volume	81
DOIs	https://doi.org/10.1016/j.matlet.2012.05.015
Publication status	Published - 15 Aug 2012
Externally published	Yes

Keywords

Adhesion
Chemical vapor deposition
Electroplating
Interlayer
Thin films

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

More information

10.1016/j.matlet.2012.05.015

Cite this

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title = "Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer",

abstract = "Large area diamond films were successfully fabricated on copper (Cu) substrates by first electroplating a Cu-diamond composite layer with a tiny amount (0.05-0.1 wt.%) of chromium (Cr) in Cu and then growing the continuous diamond film on the composite interlayer by hot-filament chemical vapor deposition (HFCVD). The interfacial characteristics were investigated in detail by scanning electron microscopy and indentation test. The results show that using this new approach, the diamond coating could be firmly adhered to the substrate during rapid cooling after HFCVD. Doping Cr into the Cu-diamond composite interlayer and anchoring the diamond particles deep in the Cu(Cr) matrix are responsible for the much improved interface adhesion between coating and substrate.",

keywords = "Adhesion, Chemical vapor deposition, Electroplating, Interlayer, Thin films",

author = "Qiu, {W. Q.} and Liu, {Z. W.} and He, {L. X.} and Zeng, {D. C.} and Mai, {Y. W.}",

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AU - Qiu, W. Q.

AU - Liu, Z. W.

AU - He, L. X.

AU - Zeng, D. C.

AU - Mai, Y. W.

PY - 2012/8/15

Y1 - 2012/8/15

N2 - Large area diamond films were successfully fabricated on copper (Cu) substrates by first electroplating a Cu-diamond composite layer with a tiny amount (0.05-0.1 wt.%) of chromium (Cr) in Cu and then growing the continuous diamond film on the composite interlayer by hot-filament chemical vapor deposition (HFCVD). The interfacial characteristics were investigated in detail by scanning electron microscopy and indentation test. The results show that using this new approach, the diamond coating could be firmly adhered to the substrate during rapid cooling after HFCVD. Doping Cr into the Cu-diamond composite interlayer and anchoring the diamond particles deep in the Cu(Cr) matrix are responsible for the much improved interface adhesion between coating and substrate.

AB - Large area diamond films were successfully fabricated on copper (Cu) substrates by first electroplating a Cu-diamond composite layer with a tiny amount (0.05-0.1 wt.%) of chromium (Cr) in Cu and then growing the continuous diamond film on the composite interlayer by hot-filament chemical vapor deposition (HFCVD). The interfacial characteristics were investigated in detail by scanning electron microscopy and indentation test. The results show that using this new approach, the diamond coating could be firmly adhered to the substrate during rapid cooling after HFCVD. Doping Cr into the Cu-diamond composite interlayer and anchoring the diamond particles deep in the Cu(Cr) matrix are responsible for the much improved interface adhesion between coating and substrate.

KW - Adhesion

KW - Chemical vapor deposition

KW - Electroplating

KW - Interlayer

KW - Thin films

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U2 - 10.1016/j.matlet.2012.05.015

DO - 10.1016/j.matlet.2012.05.015

M3 - Journal article

AN - SCOPUS:84862220339

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VL - 81

SP - 155

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JO - Materials Letters

JF - Materials Letters

ER -

Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

Abstract

Keywords

ASJC Scopus subject areas

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