TY - JOUR
T1 - Highly Thermally Conductive Dielectric Nanocomposites with Synergistic Alignments of Graphene and Boron Nitride Nanosheets
AU - Guo, Fengmei
AU - Shen, Xi
AU - Zhou, Jiaming
AU - Liu, Dan
AU - Zheng, Qingbin
AU - Yang, Jinglei
AU - Jia, Baohua
AU - Lau, Alan K.T.
AU - Kim, Jang Kyo
N1 - Funding Information:
This project was financially supported by the Research Grants Council (GRF Projects: 16229216, 16205517, 16209917) and the Innovation and Technology Commission (ITS/012/19) of Hong Kong SAR. Technical assistance from the Materials Characterization and Preparation Facilities (MCPF), the Advanced Engineering Material Facility (AEMF), the Department of Electronic and Computer Engineering (Prof. Philip K. T. Mok) at HKUST, and the College of Engineering at Peking University (Prof. Shulin Bai and Mr. Haoming Fang) are appreciated.
Publisher Copyright:
© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
PY - 2020/3/12
Y1 - 2020/3/12
N2 - Electrically insulating polymer dielectrics with high energy densities and excellent thermal conductivities are showing tremendous potential for dielectric energy storage. However, the practical application of polymer dielectrics often requires mutually exclusive multifunctional properties such as high dielectric constants, high breakdown strengths, and high thermal conductivities. The rational assembly of 2D nanofillers of boron nitride nanosheets (BNNS) and reduced graphene oxide (rGO) into a well-aligned micro-sandwich structure in polyimide (PI) composites is reported. The alternating stacking of rGO and BNNS synergistically exploits the large difference in their electrical conductivities to yield a high dielectric constant with a moderate breakdown strength. Moreover, the distinctively separated rGO and BNNS layers give rise to higher thermal conductivities of composites than those containing mixed fillers because of reduced phonon scattering at the interfaces between two identical fillers, as verified by molecular dynamics simulations. Consequently, the micro-sandwich nanocomposite prevails over the PI film with a simultaneously high dielectric constant of ≈579, a high energy density (43-fold higher than PI) and an excellent thermal conductivity (11-fold higher than PI) at a low hybrid filler content of only 2.5 vol%. The multifunctional nanocomposites developed in this work are promising for flexible dielectrics with excellent heat dissipation.
AB - Electrically insulating polymer dielectrics with high energy densities and excellent thermal conductivities are showing tremendous potential for dielectric energy storage. However, the practical application of polymer dielectrics often requires mutually exclusive multifunctional properties such as high dielectric constants, high breakdown strengths, and high thermal conductivities. The rational assembly of 2D nanofillers of boron nitride nanosheets (BNNS) and reduced graphene oxide (rGO) into a well-aligned micro-sandwich structure in polyimide (PI) composites is reported. The alternating stacking of rGO and BNNS synergistically exploits the large difference in their electrical conductivities to yield a high dielectric constant with a moderate breakdown strength. Moreover, the distinctively separated rGO and BNNS layers give rise to higher thermal conductivities of composites than those containing mixed fillers because of reduced phonon scattering at the interfaces between two identical fillers, as verified by molecular dynamics simulations. Consequently, the micro-sandwich nanocomposite prevails over the PI film with a simultaneously high dielectric constant of ≈579, a high energy density (43-fold higher than PI) and an excellent thermal conductivity (11-fold higher than PI) at a low hybrid filler content of only 2.5 vol%. The multifunctional nanocomposites developed in this work are promising for flexible dielectrics with excellent heat dissipation.
KW - dielectric properties
KW - graphene
KW - hexagonal boron nitride nanosheets
KW - sandwich nanocomposites
KW - thermal conductivity
UR - http://www.scopus.com/inward/record.url?scp=85081743019&partnerID=8YFLogxK
U2 - 10.1002/adfm.201910826
DO - 10.1002/adfm.201910826
M3 - Journal article
AN - SCOPUS:85081743019
SN - 1616-301X
VL - 30
JO - Advanced Functional Materials
JF - Advanced Functional Materials
IS - 19
M1 - 1910826
ER -